Berner A, Mundim KC, Ellis DE, Dorfman S, Fuks D, Evenhaim R
SENSORS AND ACTUATORS A-PHYSICAL
74: (1-3) 86-90 APR 20 1999
Cited References: 12 Times Cited: 0
Abstract:
Existence of dilute copper-carbon
solid solutions is one of the characteristic features of the interfaces
of the metal matrix composites widely used in the electrical applications.
Experimental high-resolution SEM study allows to visualize the formation
of the interaction zone on carbon fibre. We model interstitial solid solutions
formed in this interaction zone non-empirically within the embedded-cluster
and supercell approaches. Atomistic approach allows selection of the geometry
of the solid solution. Electronic structure studies show that the most
favourable position of the carbon atom is shifted along the [110] direction
from the centre of the octahedral position. Investigation of this physical
phenomenon allows us to understand the nature of the chemical bonding in
copper-based solid solutions with carbon. (C) 1999 Elsevier Science S.A.
All rights reserved.
Author Keywords:
metal matrix composites, interfaces, copper, chemical bonding, atomistic
simulations
KeyWords Plus:
CARBON, COPPER
Addresses:
Berner A, Technion Israel Inst Technol, Dept Mat Engn, IL-32000 Haifa,
Israel.
Technion Israel Inst Technol, Dept Mat Engn, IL-32000 Haifa, Israel.
Northwestern Univ, Dept Phys & Astron, Evanston, IL 60208 USA.
Technion Israel Inst Technol, Dept Phys, IL-32000 Haifa, Israel.
Ben Gurion Univ Negev, Dept Mat Engn, Beer Sheva, Israel.
Publisher: ELSEVIER SCIENCE SA, LAUSANNE
IDS Number: 187ZZ
ISSN: 0924-4247