Cited References : 5                   Times Cited : 0

Abstract:
        Formation of Cu-C composite is a difficult technological problem: carbon is practically insoluble in copper. We show that the heat treatment of the Cu-C composite leads to the formation of a thin (approximately 50 nm) interface which provides the bonding between fiber and matrix. The HR SEM study displays the formation of small copper nano-crystals in the interaction zone. This structure of the interface is predicted by molecular dynamic and Monte Carlo simulations with semi-empirical repulsive Cu-C interatomic potentials. We show that inclusion of a small amount of carbon in fee copper leads to strong deformation of the copper host matrix in the vicinity of carbon. Decrease of stresses in the lattice may be reached by the formation of the developed surface in nano-crystalline structure. (C) 1999 Elsevier Science B.V. All rights reserved.

Author Keywords:
interfaces, nano-phase, SEM, bonding, solid solutions

KeyWords Plus:  CARBON

Addresses:
Berner A, Technion Israel Inst Technol, Dept Mat Engn, IL-32000 Haifa, Israel.
Technion Israel Inst Technol, Dept Mat Engn, IL-32000 Haifa, Israel.
Ben Gurion Univ Negev, Dept Mat Engn, Beer Sheba, Israel.
Northwestern Univ, Dept Phys & Astron, Evanston, IL 60208 USA.
Univ Fed Bahia, Inst Fis, Salvador, BA, Brazil.
Technion Israel Inst Technol, Dept Phys, IL-32000 Haifa, Israel.

Publisher: ELSEVIER SCIENCE BV, AMSTERDAM
IDS Number: 200QV
ISSN:  0169-4332